| 摘要 |
The present invention relates to a mold apparatus for molding a metal in a high vacuum environment, the apparatus comprising: a fixed mold (110); a movable mold (120) which is in contact with the upper section of the fixed mold (110) so as to form a cavity (130); and an ejector pin (140) which is formed so as to pass through the movable mold (120) and reach the cavity (130). In a state that a vacuum environment is created by pulling out air from the cavity (130) by using an exhaust apparatus (190), a molten metal is filled and molded, and thereafter a molded product is pushed and demolded using the ejector pin (140). A sealing plate (150) is tightly laid on the upper section of the movable mold (120) so that the ejector pin (140) passes through the sealing plate (150) and the movable mold (120) in order, and a packing (P1) is installed in a hole on the sealing plate (150) through which the ejector pin (140) passes so that external air is prevented from flowing into the cavity (130). A blocking space (180) is formed between the movable mold (120) and the packing (P1), thereby blocking heat from being conducted to the packing (P1). That is, the present invention relates to a mold apparatus for molding a metal in a high vacuum environment, which: enables the metal to be molded in a state of forming, in a high vacuum, a space where the metal is molded, so that the physical properties of a molten metal can be prevented from being changed when the molten metal is in contact with air; can minimize damage by heat due to a packing, which is installed in order to block external air from flowing into the space where the metal is formed; and is economical due to the use of the packing, which is less costly. |
