| 摘要 |
<p>A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1′) and application of a dielectric insulating foil (3, 3′) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4′) to the insulating layer (3, 3′); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1′) plus insulating layer (3, 3′) and conducting paths (4, 4′) by interposing a prepreg layer (5, 85; 18, 18′), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.</p> |
