发明名称 研磨剤及び基板の研磨方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an abrasive and a polishing method which are capable of rapidly polishing a surface to be polished of an inorganic insulating film layer or the like while suppressing generation of polishing scratches. <P>SOLUTION: The abrasive contains metal oxide particles and a medium. The metal oxide particles include metal oxide particles obtained by firing a metal oxide produced by heating a mixture containing a metal salt, a polymer compound, and a high boiling point organic solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5842250(B2) 申请公布日期 2016.01.13
申请号 JP20110254113 申请日期 2011.11.21
申请人 国立研究開発法人産業技術総合研究所 发明人 小山 直之;町井 洋一;伊豆 典哉;松原 一郎;申 ウソク;伊藤 敏雄
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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