PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A package structure and a manufacturing method thereof are disclosed. According to an aspect of the present invention, the package structure comprises: a stiffener substrate; an insulating layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the insulating layer to protect the circuit pattern layer; a first electrode post protruding by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer which is in a protruding direction of the first electrode post.