OPTOELECTRONIC PACKAGE

摘要

In described examples, an optoelectronic package (200) includes an inner package (100) with a dielectric substrate having at least a first dielectric level with a photodetector (PD) die (110) on a die attach area, first routing connecting a first contact to a first external bond pad (FEBP 111), and second routing connecting a second contact to a second external bond pad (SEBP 112). An outer package (OP 170) includes a ceramic substrate (171) including a light source die (180) on a base portion (171a) in direct line of sight with the PD including a first electrode (181) and second electrode (182). A first wire bond (161) connects the FEBP (111) to a first terminal (191), a second wire bond (162) connects the SEBP (112) to a second terminal (192), a third wire bond (165) connects the first electrode to a third terminal (193), and a fourth wire bond (166) connects the second electrode to a fourth terminal (194).