| 摘要 |
The present invention relates to a package for an optical communication module, in which an optical semiconductor device and an optical fiber are arranged together therein and sealed and sewed, so contact with air and moisture is prevented. Accordingly, life spans of the optical semiconductor device and optical fiber may be extended. The package for an optical communication module comprises: a base unit; a lower side pipe; an upper side pipe; and a cover unit. The base unit includes a bottom plate, and a wall surface vertically extending along a circumference of the bottom plate. The optical semiconductor device is accommodated therein, and a groove is formed in one side of the wall surface. The lower side pipe outwardly protrudes from a bottom surface of the groove, and has a cut upper side to wrap a lower side of the optical fiber. The upper side pipe has a cut lower side to come in contact with the lower side pipe while wrapping an upper side of the optical fiber. The cover unit is formed to cover an upper side of the base unit. |
