Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product

摘要

There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.

主权项

1. A method for processing a translucent rigid substrate laminate comprising the steps of:
preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with adhesive X, adhesive Y, or combination thereof described below; an adhesive composition, which contains (A′) polyfunctional (meth)acrylate, (B′) monofunctional (meth)acrylate, (C′) organic peroxide, and (D′) decomposition accelerator of the organic peroxide, in which total mass of the constituents (A′), (B′), (C′), and (D′) occupies 90% by mass or more of the composition an adhesive composition, which contains (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate, and (C) photopolymerization initiator, in which total mass of the constituents (A), (B), and (C) occupies 90% by mass or more of the composition performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more, wherein the processing B is performed, and the adhesive X and the adhesive Y are applied to the cradle and/or the bonding planes of the laminates in an application pattern in which the adhesive Y surrounds the adhesive X.