| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Entry of resin into a cylindrical electrode can be suppressed without excessively increasing the number of parts and without unnecessarily damaging members. For this purpose, a semiconductor chip and a cylindrical electrode are mounted on one main surface of substrate. The substrate, the semiconductor chip, and the cylindrical electrode are sealed with resin material such that the cylindrical electrode has one end mounted to the substrate and the other opposite end at least exposed. After the step of sealing, an opening extending from the other end of the cylindrical electrode to a cavity in the cylindrical electrode is formed. Before performing the step of forming an opening, the other end of the cylindrical electrode is closed. |
| 申请公布号 |
US2015380274(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514665577 |
申请日期 |
2015.03.23 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
YOSHIMATSU Naoki;UCHIDA Kiyohiro;SHIKANO Taketoshi;SHINKAI Masayoshi |
| 分类号 |
H01L21/48;H01L23/498;H01L23/00;H01L21/56 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a semiconductor device, comprising the steps of:
mounting a semiconductor chip and a cylindrical electrode on one main surface of a substrate; sealing said substrate, said semiconductor chip, and said cylindrical electrode with resin material such that said cylindrical electrode has one end mounted to said substrate and the other opposite end at least exposed; and forming an opening extending from said other end of said cylindrical electrode to a cavity in said cylindrical electrode after said step of sealing, before performing said step of forming an opening, said other end of said cylindrical electrode is closed. |
| 地址 |
Tokyo JP |
