PRINTED WIRING BOARD, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

A printed wiring board according to one embodiment of the present invention is provided with a base film that has insulating properties and a conductive pattern that is layered on at least one surface side of the base film. At least part of the conductive pattern comprises a core body and a shrink layer that is layered on the outer surface of the core body by plating. The abovementioned part of the conductive pattern may have a stripe shape or a spiral shape. The abovementioned part of the conductive pattern preferably has an average circuit interval of 30 µm or less. The abovementioned part of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating may be electroplating or electroless plating.