| 摘要 |
The present invention provides a wafer product decorating apparatus comprising a laser, a collimator, at least one galvanometer driven mirror, and an aspheric scan lens, the apparatus being positionable relative to the wafer product to be decorated wherein the apparatus is configured to provide a laser beam having a spot size of from 100 to 750µm in diameter on the surface of the product to be decorated and a substantially flat focal plane, characterised in that the focal plane has a depth of field of from 5mm to 20mm and that the focal plane of the laser beam is from 5mm to 30mm above or below the surface of the product to be decorated. The invention also provides a process for decorating a wafer product. |
