| 摘要 |
A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12). |
