CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

To eliminate the defect of poor vulcanization resistance in the prior art, the present invention provides a curable organopolysiloxane composition and a semiconductor device. In a cured state and under conditions that the temperature is 25°C and the humidity is 60% RH, the composition has the tensile strength of 2 to 8 Mpa, the elongation at break of 35% to 100% and the index of refraction being equal to or greater than 1.45. The composition comprises: (A) organopolysiloxane comprising an R1 3SiO1/2 unit, an R2 2SiO2/2 unit and an R3SiO3/2 unit; (B) branched polyorganohydrogensiloxane having the viscosity of 300 to 4000 mPa·s, wherein each molecule has on average at least three hydrogen atoms bonded with silicon atoms and at least one aromatic group, and the content of the aromatic group is larger than 10 mol%; and (C) a hydrosilylation catalyst having the content capable of facilitating curing of the composition. Compared with the prior art, the present invention maintains good thermal shock resistance, high index of refraction and high hardness, and has excellent vulcanization resistance and humidity resistance.