A RAMP-STACK CHIP PACKAGE WITH MECHANICAL STOPS

摘要

A chip package is described (450). This chip package includes a stack of semiconductor dies (110-1,110-2,110-N) or chips that are offset from each other, thereby defining a terrace with exposed pads. A ramp component (112), which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. Mechanical stops (460-1) are formed on respective semiconductor die for mechanical contact between the semiconductor die and the ramp component. The ramp component is electrically coupled to the semiconductor dies using microsprings (114). Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. By removing the need for costly and area-consuming through-silicon vias ( TSV s) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.