发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device has a semiconductor layer, a floating gate electrode provided over the semiconductor layer via a first insulation film, and an erase gate electrode to which an erase voltage is applied. The floating gate electrode has an opposing region that opposes via a second insulation film to the erase gate electrode. The opposing region has such a shape that multiple electric field concentrating portions are formed when the erase voltage is applied to the erase gate electrode. |
申请公布号 |
US9219134(B2) |
申请公布日期 |
2015.12.22 |
申请号 |
US201314067267 |
申请日期 |
2013.10.30 |
申请人 |
Renesas Electronics Corporation |
发明人 |
Fukumoto Hideto |
分类号 |
G11C11/34;H01L29/66;G11C16/04;H01L29/423;H01L29/788;H01L27/115 |
主分类号 |
G11C11/34 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A semiconductor device comprising:
a semiconductor layer; a floating gate electrode provided over the semiconductor layer via a first insulation film; and an erase gate electrode to which an erase voltage is applied, wherein the floating gate electrode has an opposing region that opposes via a second insulation film to the erase gate electrode, and wherein the opposing region has such a shape that a plurality of electric field concentration portions are formed when the erase voltage is applied to the erase gate electrode, wherein a cross sectional shape of the floating gate electrode has a plurality of corners in the opposing region, and wherein a plurality of portions are formed to the erase gate electrode so as to conform to the plurality of corners. |
地址 |
Kanagawa JP |