| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having higher reliability; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device of an embodiment comprises an insulating resin, wiring, a plurality of semiconductor elements and a first metallic component. The insulating resin includes a first region and a second region. In a first direction crossing a direction from the first region toward the second region, the wiring is lined with the first region. The plurality of semiconductor elements are provided between the first region and the wiring. At least one of the plurality of semiconductor elements is electrically connected with the wiring. The first metallic component includes a first penetration part which pierces the second region in the first direction and a first end connected to the first penetration part. In a second direction crossing the first direction, a width of the first end is wider than a width of the first penetration part. |
