MULTI-LEVEL METALIZATION ON A CERAMIC SUBSTRATE

摘要

The invention relates to a method for producing a copper multi-level metallization on a ceramic substrate (4) consisting of AIN or Al2O3. High power regions (1) with metallization having a high current-carrying capacity and low power regions (2) with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate (4). According to the invention, the metallization is printed multiple times in the high power range.