发明名称 THIN FILM PATTERNING METHOD AND THIN FILM PATTERNING APPARATUS
摘要 Disclosed herein is a thin film patterning method and a thin film patterning apparatus. The thin film patterning method comprises the steps of: disposing a mask above a substrate, wherein the mask is provided with hollow-out parts which are identical with preset deposition patterns; and covering the mask with a thin film, wherein the thin film at hollow-out parts of the mask is formed on the substrate, while the remaining area of the substrate shielded by the mask is free of the thin film, so that a patterned thin film is formed on the substrate. The thin film patterning method in the present disclosure can transfer directly patterns on the mask to the substrate through one-step deposition, omit the process steps of photolithography and etching, simplify the process flow to a large extent, and save the costs of the thin film patterning.
申请公布号 US2015360253(A1) 申请公布日期 2015.12.17
申请号 US201414527565 申请日期 2014.10.29
申请人 BOE TECHNOLOGY GROUP CO., LTD. ;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. 发明人 Liu Yu;Min Chonkyu;Zhang Kunpeng;Wang Fengguo;Bai Nini
分类号 B05B15/04 主分类号 B05B15/04
代理机构 代理人
主权项 1. A thin film patterning method, comprising: disposing a mask above a substrate, wherein the mask is provided with hollow-out parts which are identical with preset deposition patterns; and covering the mask with a thin film, wherein the thin film at the hollow-out parts of the mask is formed on the substrate, while the remaining area of the substrate shielded by the mask is free of the thin film, so that a patterned thin film is formed on the substrate.
地址 Beijing CN