发明名称 |
THIN FILM PATTERNING METHOD AND THIN FILM PATTERNING APPARATUS |
摘要 |
Disclosed herein is a thin film patterning method and a thin film patterning apparatus. The thin film patterning method comprises the steps of: disposing a mask above a substrate, wherein the mask is provided with hollow-out parts which are identical with preset deposition patterns; and covering the mask with a thin film, wherein the thin film at hollow-out parts of the mask is formed on the substrate, while the remaining area of the substrate shielded by the mask is free of the thin film, so that a patterned thin film is formed on the substrate. The thin film patterning method in the present disclosure can transfer directly patterns on the mask to the substrate through one-step deposition, omit the process steps of photolithography and etching, simplify the process flow to a large extent, and save the costs of the thin film patterning. |
申请公布号 |
US2015360253(A1) |
申请公布日期 |
2015.12.17 |
申请号 |
US201414527565 |
申请日期 |
2014.10.29 |
申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. |
发明人 |
Liu Yu;Min Chonkyu;Zhang Kunpeng;Wang Fengguo;Bai Nini |
分类号 |
B05B15/04 |
主分类号 |
B05B15/04 |
代理机构 |
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代理人 |
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主权项 |
1. A thin film patterning method, comprising:
disposing a mask above a substrate, wherein the mask is provided with hollow-out parts which are identical with preset deposition patterns; and covering the mask with a thin film, wherein the thin film at the hollow-out parts of the mask is formed on the substrate, while the remaining area of the substrate shielded by the mask is free of the thin film, so that a patterned thin film is formed on the substrate. |
地址 |
Beijing CN |