| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet less likely to cause the protrusion of adhesive sheet and the defective embedding of bonding wires during embedding bonding wires, and to provide a cured product having excellent heat resistance. <P>SOLUTION: The adhesive sheet 3 is used for bonding a semiconductor chip 2 so that parts of the bonding wires 7a and 7b are embedded in the adhesive sheet 3 on a substrate member 1 in which the bonding wires 7a and 7b are connected to the upper side 1a. The adhesive sheet 3 comprises: a flexible epoxy resin (A1); an epoxy group-containing a polymer (A2); an epoxy resin (A3) except the flexible epoxy resin (A1) and the high-molecular polymer (A2); and a curing agent (B), wherein the adhesive sheet 3 has a viscosity of 500-5,000 Pa s at a temperature when the parts of the bonding wires 7a and 7b are embedded in the adhesive sheet 3. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
