发明名称 |
CERAMIC SUBSTRATE HAVING THERMAL VIA |
摘要 |
The present invention relates to a ceramic substrate having a thermal via passing through the substrate for purposes of radiating heat to the outside, wherein the ceramic substrate has a reinforcing structure that divides the opening of the thermal via into two or more parts, and the height of the reinforcing structure is less than the height of the thermal via. |
申请公布号 |
WO2009076494(A2) |
申请公布日期 |
2009.06.18 |
申请号 |
WO2008US86338 |
申请日期 |
2008.12.11 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY;NARITA, HIDEFUMI;INABA, AKIRA |
发明人 |
NARITA, HIDEFUMI;INABA, AKIRA |
分类号 |
H01L23/367 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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