| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of bringing the bonding surfaces of a lid and a container into close contact with each other via a sealing material and surely bonding the lid and the container together. SOLUTION: In this manufacturing method of the electronic component, an electronic component element is mounted in a cavity 105 of the container, the lid 101 is dropped into a recess 112 of a sealing jig 111 having the recess 112, the container 104 with the electronic component element mounted is dropped on the upper part of the lid 101 via a sealing material 102 with the cavity 105 facing downward, the container 104 is pressed against the lid 101, the lid 101 is deformed along the bonding surface between the lid and the container 104, the container 104 and the lid 101 are brought into close contact with each other via the sealing material, the sealing material 102 is melted in the state with the container 104 pressed against the lid 101, and the container 104 and the lid 101 are hermetically sealed. COPYRIGHT: (C)2009,JPO&INPIT
|
