| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation film that has a low dielectric constant, and has improved characteristics of stability with time in the dielectric constant, mechanical strength, adhesiveness, and the like. SOLUTION: A composition for forming a film containing an organic compound and a hole-forming agent is applied onto a substrate to form coating on the substrate, and the coating is cured and is treated by a supercritical medium containing a pore-sealing agent, thus obtaining the low dielectric-constant interlayer dielectric. COPYRIGHT: (C)2009,JPO&INPIT
|
