| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate manufacturing method which provides easy separation of a circuit stack body, which formed on a support body used for manufacturing a coreless thin substrate, from the support body and reduced manufacturing cost by reducing the number of process and required materials. <P>SOLUTION: The substrate manufacturing method comprises: providing the support body which has a first separation layer formed on one surface; forming a second separation layer on one surface of the first separation layer, the second separation layer covering a portion of the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming the circuit stack body on one surface of the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
