发明名称 Electronic component mounting apparatus
摘要 The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.
申请公布号 US7712208(B2) 申请公布日期 2010.05.11
申请号 US20060605471 申请日期 2006.11.29
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 WATANABE AKIO;KAWAI AKIHIRO;ONO TETSUJI;KAMEDA MAKIO;OYAMA KAZUYOSHI;IEIZUMI KAZUYOSHI
分类号 B23P19/00 主分类号 B23P19/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利