发明名称 |
METHOD OF SUBSTRATE TREATMENT, RECORDING MEDIUM AND SUBSTRATE TREATING APPARATUS |
摘要 |
A method of processing a substrate by a substrate processing apparatus is disclosed. The substrate processing apparatus includes a processing container including a first space where a first processing gas or a second processing gas is supplied onto the substrate and a second space formed around the first space; a first exhaust unit configured to evacuate the first space; and a second exhaust unit configured to evacuate the second space. The method includes a first step of supplying the first processing gas into the first space; a second step of discharging the first processing gas from the first space; a third step of supplying the second processing gas into the first space; and a fourth step of discharging the second processing gas from the first space; wherein the pressure in the second space is adjusted by a pressure-adjusting gas supplied into the second space.
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申请公布号 |
US2009220692(A1) |
申请公布日期 |
2009.09.03 |
申请号 |
US20060817717 |
申请日期 |
2006.02.20 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TAKAGI TOSHIO;KANEKO HIROSHI;IWATA TERUO;TAKEYAMA TAMAKI;KAKIMOTO AKINOBU |
分类号 |
C23C16/06;B05C11/00;C23C16/00 |
主分类号 |
C23C16/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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