| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost substrate feeder reducing the footprint and easily changing substrate feeding to other types, and also to provide a substrate feeding method thereof. SOLUTION: Disclosed is a substrate feeder that feeds substrates 40 to the transfer path 55 of a semiconductor assembly apparatus 59 either from a first magazine 50a that piles substrates 40 in a controlled manner or a second magazine 50b that piles the substrates 40 in a non-controlled manner. The substrate feeder is provided with: a feeding position transfer mechanism 1 that transports the magazine 50 in a vertical direction; and a transfer mechanism 2 that transports the substrate 40 from the magazine 50 of the feeding position transfer mechanism 1 to the transfer path 55. When the substrate 40 is supplied from the first magazine 50a, the first magazine 50a is held by the feeding position transfer mechanism 1, and pushed out of the first magazine 50a. When the substrate 40 is supplied from the second magazine 50b, the second magazine 50b is held by the feeding position transfer mechanism 1, and the substrate 40 is supplied from the second magazine 50b to the transfer path 55 by the transfer mechanism 2. COPYRIGHT: (C)2011,JPO&INPIT |
