发明名称 |
STACKED INDUCTOR-ELECTRONIC PACKAGE ASSEMBLY AND TECHNIQUE FOR MANUFACTURING SAME |
摘要 |
An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor. |
申请公布号 |
US2011134613(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20100962053 |
申请日期 |
2010.12.07 |
申请人 |
INTERSIL AMERICAS INC. |
发明人 |
MOUSSAOUI ZAKI;KELKAR NIKHIL VISHWANATH |
分类号 |
H05K7/06;H05K1/18;H05K13/00 |
主分类号 |
H05K7/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|