发明名称 HEAT-CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To economically-advantageously and stably manufacture a heat-conductive film having both high insulation property and heat conductivity. SOLUTION: This heat-conductive film of a multilayer structure is manufactured by performing co-extrusion and film formation so that an insulation layer is arranged on one surface or each of both surfaces of a heat-conductive resin layer containing 10-90 vol.% of a filler having electric conductivity and heat conductivity. The resin constituting the heat-conductive resin layer is preferably a polyolefin resin, wherein the density, the DSC melting point and the bending elastic modulus of the polyolefin resin are preferably 0.85-0.90 g/cm<SP>3</SP>, 110-140&deg;C, and 5-100 MPa, respectively. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP2010278293(A) 申请公布日期 2010.12.09
申请号 JP20090130260 申请日期 2009.05.29
申请人 DAINIPPON PRINTING CO LTD 发明人 KITSUTANI NOZOMI;UEKI TAKAYUKI;MITA KOZO
分类号 H01L23/36;B32B27/18 主分类号 H01L23/36
代理机构 代理人
主权项
地址