| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable pretesting of each package, and increase final test yields of product MPMs. <P>SOLUTION: A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module provides a lower molded package including a lower substrate and a die, affixes an upper molded package including an upper substrate onto the upper surface of the lower package, and forms z-axis interconnects between the upper and the lower substrates. <P>COPYRIGHT: (C)2011,JPO&INPIT |
