| 摘要 |
A short dummy test structure is disclosed, including a grounded shield layer above a substrate, at least two signal test pads, and a signal transmission line above the grounded shield layer and between the two signal test pads, wherein the signal transmission line is electrically coupled to the grounded shield layer. In one embodiment, the signal transmission line has a smaller total length than a total length of a corresponding signal transmission line and a device-under-test (DUT) of a test structure including the DUT. A de-embedding apparatus and method of de-embedding utilizing such a short dummy test structure are also disclosed.
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