WIRING BOARD, SEMICONDUCTOR DEVICE AND WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board, a semiconductor device and a wiring board manufacturing method which can improve yield of the semiconductor device.

SOLUTION: The wiring board 1 includes a wiring pattern 20 on an uppermost layer having a pad 21 and a solder resist layer 30 covering the wiring pattern 20. On the solder resist layer 30, a recess 30a for exposing a part of the wiring pattern as the pad 21 is formed. The solder resist layer 30 includes a solder resist layer 31 formed on a region corresponding to the recess 30a, a solder resist layer 32 formed on an outer region of the recess 30a and a solder resist layer 33 formed on an inner region of the recess 30a. The top face of the solder resit layer 31 is formed higher than the top face of the pad 21 and lower than the top faces of the solder resist layers 32, 33.

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