| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To facilitate production of an electronic substrate having a stabilized structure in which cracking does not occur easily. <P>SOLUTION: The electronic substrate has electronic components 20 and 21, and conduction wiring connected by the wiring joints 20a and 21a of the electronic components 20 and 21. The process for producing an electronic substrate comprises a step for mounting the electronic components 20 and 21 while abutting the wiring joints 20a and 21a against the surface of a base S, a step for forming an insulating layer 60A around the electronic components 20 and 21 on the surface of the base S by applying a photocuring and thermosetting insulating material with a thickness thinner than that of the electronic components 20 and 21, a step for forming a resin layer 13 in which the electronic components 20 and 21 are embedded on the insulating layer 60A, and a step for forming conduction wiring on the insulating layer 60A by stripping the base S from the electronic components 20 and 21. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
