发明名称 |
SUBSTRATE HOLDER, SUBSTRATE BONDING APPARATUS, METHOD FOR MANUFACTURING MULTILAYER SEMICONDUCTOR DEVICE, AND MULTILAYER SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To shorten a time required for a substrate aligning process. <P>SOLUTION: There is provided a substrate holder including: a holder body of which the mounting surface a substrate is mounted thereon; and a connection member comprising a pair of terminals provided in the holder body and a connection line for electrically connecting the pair of terminals together, wherein when the holder body is disposed at a predetermined position, the pair of terminals come into contact with external terminals to form an electrically closed circuit. The substrate holder also includes an electrostatic attraction part which is provided in the holder body separately from the connection member and electrostatically attracts the substrate to the mounting surface by power supply from outside. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012059882(A) |
申请公布日期 |
2012.03.22 |
申请号 |
JP20100201015 |
申请日期 |
2010.09.08 |
申请人 |
NIKON CORP |
发明人 |
MAEDA HIDEHIRO |
分类号 |
H01L21/673;H01L21/02;H01L21/683;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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