发明名称 CONDUCTIVE POWDER, AND CONDUCTIVE PASTE
摘要 <P>PROBLEM TO BE SOLVED: To provide conductive powder that still achieves superior conductivity even with a smaller amount of silver, in a conductive powder consisting of a copper powder particle having a particle surface coated with a silver layer. <P>SOLUTION: In dendrite conductive powder provided with the silver layer formed on the surface of the copper powder particle, the content of silver is 3-30 mass% of the content of cooper. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153967(A) 申请公布日期 2012.08.16
申请号 JP20110016613 申请日期 2011.01.28
申请人 MITSUI MINING & SMELTING CO LTD 发明人 WAKIMORI YASUNARI;MIWA MASAHIRO
分类号 B22F1/02;B22F1/00;H01B1/22;H01B5/00 主分类号 B22F1/02
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