发明名称 |
CONDUCTIVE POWDER, AND CONDUCTIVE PASTE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide conductive powder that still achieves superior conductivity even with a smaller amount of silver, in a conductive powder consisting of a copper powder particle having a particle surface coated with a silver layer. <P>SOLUTION: In dendrite conductive powder provided with the silver layer formed on the surface of the copper powder particle, the content of silver is 3-30 mass% of the content of cooper. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012153967(A) |
申请公布日期 |
2012.08.16 |
申请号 |
JP20110016613 |
申请日期 |
2011.01.28 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
WAKIMORI YASUNARI;MIWA MASAHIRO |
分类号 |
B22F1/02;B22F1/00;H01B1/22;H01B5/00 |
主分类号 |
B22F1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|