发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which generates plasma having high uniformity. <P>SOLUTION: A plasma processing apparatus includes: a processing container C where plasma processing is performed; an RF generator 14 applying high frequency power to a lower electrode 12 provided at the processing container C; a matching box 15 provided between the RF generator 14 and the lower electrode 12 and connected with the RF generator 14 by using a coaxial cable 16. A bypass path 30, connecting a line 16a on the ground side of the coaxial cable 16 with an upper electrode 11 facing the lower electrode 12, is provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030392(A) 申请公布日期 2013.02.07
申请号 JP20110166441 申请日期 2011.07.29
申请人 TOKYO ELECTRON LTD 发明人 NONAKA TATSU
分类号 H05H1/46;C23C16/509;H01L21/205;H01L21/3065;H01L21/31 主分类号 H05H1/46
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