MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC COMPONENT MOUNTING FRAME, ELECTRONIC COMPONENT STORED IN MOUNTING FRAME, AND SURFACE MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To enhance the mounting efficiency of a chip component, by feeding a small chip component efficiently to a surface mounting device.SOLUTION: The manufacturing method of an electronic device includes: a step for preparing a mounting frame having a planar support frame provided with a through opening in the center, and an adhesive sheet provided on the support sheet so as to be stretched across the through opening and having an adhesive layer on the surface so that a chip component can be stuck thereto; an electronic component transfer step for taking out a diced chip component from a dicing frame and arranging the chip component on the surface of the adhesive sheet of the mounting frame; a step for attaching the mounting frame on which a chip component is arranged to a surface mounting device; and a mounting step for mounting the chip component, arranged on the mounting frame, on a wiring board by using the surface mounting device.