| 摘要 |
A method and a device for the simultaneous joining of multi conductors are provided. A method for the simultaneous joining of multi conductors according to one aspect of the present invention includes: a step for coating a plurality of positions on a lead bar with solders; a step for disposing a superconductive wire material on each of the solders; a step for fixing the superconductive wire material on the lead bar by means of a thermally-conductive adhesive tape; a step for heating the lead bar such that the solders are heated and molten; and a step for coating the peripheries of the solders with flux in the process of melting the solders. At this time, the thermally-conductive adhesive tape may be a Kapton tape, and a step for reducing the pressure of a space between the lead bar and the superconductive wire material may be included. |
