| 摘要 |
PROBLEM TO BE SOLVED: To facilitate separation of protective tape stuck on a surface of a wafer therefrom after the wafer is processed on a rear side thereof.SOLUTION: Protective tape 1 includes: a sheet 10 that has a diameter corresponding to a diameter of a wafer W; a ring-shaped adhesive layer 11 that is laid only on a portion of the sheet 10 corresponding to a peripheral portion Wb of the wafer W; and a separating lug 12 that is formed on a periphery 10a of the sheet 10 so as to stick out from the peripheral portion Wb of the wafer W when the ring-shaped adhesive layer 11 faces the peripheral portion Wb of the wafer W. When the lug 12 is held and pulled in a state in which the protective tape 1 is stuck on a surface W1 of the wafer W, thus, the protective tape 1 is easily separated from the surface W1 of the wafer W. |
