发明名称 |
SEMICONDUCTOR CHIP INCLUDING HEAT RADIATION MEMBER, AND DISPLAY MODULE |
摘要 |
A semiconductor chip includes a circuit region having an integrated semiconductor circuit on a semiconductor substrate, and a heat radiation member on at least a portion of a scribe lane region configured to at least partially surround the circuit region, the heat radiation member including a plurality of heat radiation fins that extend in a direction orthogonal to an upper surface of the semiconductor substrate. |
申请公布号 |
US2014014975(A1) |
申请公布日期 |
2014.01.16 |
申请号 |
US201313837757 |
申请日期 |
2013.03.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAE JONG-KON;KANG WON-SIK;WOO JAE-HYUCK;KIM SUNG-KI;KIM YANG-HYO;KIM DO-KYUNG |
分类号 |
H01L23/367;H01L33/64 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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