| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device 1 has a source electrode pad 2SP formed on a surface 2a of a semiconductor chip 2, and a metal clip (metal plate) 7 for electrically connecting a lead 4S. The metal clip 7 has a chip connection portion 7C electrically connected with the source electrode pad 2SP via a conductive bonding material 8C, a lead connection portion 7L electrically connected with the lead 4S via a conductive bonding material 8L, and an intermediate portion 7H located between the chip connection portion 7C and the lead connection portion 7L. A step portion D1 is provided between the intermediate portion 7H and the chip connection portion 7C, which has shear planes D1b, D1c that are arranged on the opposite side each other across a connection portion D1a. |
