发明名称 発熱素子の実装構造ならびに発熱素子を有する電子部品
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a high-safety packaging structure of a heater element in which the risk that a heater element is electrically short-circuited to a thermal element is low even if heat is generated abnormally, and to provide an electronic component having such a heater element. <P>SOLUTION: The packaging structure of a heater element comprises a case 11 composed of an insulating material having high thermal conductivity, a resistor 1 (heater element) housed in the case 11 and having a wire 1a led to the outside of the case 11, a thermal element 4 which can detect abnormal heat generation of the resistor 1, and a pedestal 2 composed of an insulating material having thermal conductivity higher than that of the case 11 and mounting the resistor 1. When the pedestal 2 is attached to the case 11, a part (mounting part 2g) of the pedestal 2 is exposed to the outside of the case 11, and the thermal element 4 is attached to the exposed part and brought into thermal contact therewith. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5662109(B2) 申请公布日期 2015.01.28
申请号 JP20100251776 申请日期 2010.11.10
申请人 发明人
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
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