发明名称 |
METHOD AND APPARATUS TO PREWET WAFER SURFACE FOR METALLIZATION FROM ELECTROLYTE SOLUTION |
摘要 |
<p>The present invention improves the wetting between electrolyte and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the plating process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface.</p> |
申请公布号 |
KR101487708(B1) |
申请公布日期 |
2015.01.29 |
申请号 |
KR20107011970 |
申请日期 |
2007.10.30 |
申请人 |
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发明人 |
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分类号 |
C23C18/18;C25D5/02;C25D5/34 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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