| 摘要 |
PURPOSE:The titled adhesive, containing a specific novel epoxy resin having the cyclohexane skeleton and a curing agent, having improved heat resistance and electrical characteristic and suitable for the field of structural materials in automotive and aerospace industries, etc., and electronic parts, etc. CONSTITUTION:An adhesive consisting of (A) an epoxy resin expressed by formula I [R1 is organic compound residue having l active hydrogen atoms; n1, n2...nl are integers 0-100 and the sum thereof is 1-100; l is an integer 1-100; A is cyclohexane skeleton having a substituent group expressed by formula II; X is formula III-V (R2 is H, alkyl, carboalkyl or carboaryl and one or more groups expressed by formula VI are contained in the resin expressed by formula I] and (B) a curing agent, e.g. diethylenetriamine, etc.
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