FILM POSITIVE PHOTOSENSITIVE ADHESIVE COMPOSITION, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film positive photosensitive adhesive composition capable of exhibiting appropriate fluidity in connection between semiconductor chips or connection between the semiconductor chip and a support member for mounting the semiconductor chip.SOLUTION: A film positive photosensitive adhesive composition contains (A) an alkali-soluble phenolic resin and (B) a compound generating an acid by light, and is used as an underfill material for bonding and electrically connecting semiconductor chips or the semiconductor and a support member for mounting the semiconductor chip.