| 摘要 |
PURPOSE:To remove the strain of a semiconductor chip generated in an assembly process by temporarily fastening the semiconductor chip to a stem for a semiconductor by using a temporary fastening jig, bonding wires, releasing the semiconductor chip from the temporary fastening of the temporary fastening jig and measuring the chip. CONSTITUTION:Structure in which a semiconductor chip 1 is wire-bonded with external terminals 3 for a stem 2 for a semiconductor by Au wires or Al wires 4 to a diaphragm shape from the rear is formed on a semiconductor pressure sensor device. That is, the semiconductor chip 1 is fixed temporarily to the semiconductor stem 2 by employing a temporary fastening jig 5. The semiconductor chip 1 is wired-bonded with the external terminals 3 by using the Au wires or the Al wires 4. Lastly, the semiconductor chip 1 is not brought into contact with the stem for the semiconductor and brought to the state, in which the chip 1 is wire-bonded with the external termi nals, by releasing and removing the temporary fastening jig 5, thus accurately measuring offset characteristics under the state.
|
