INTERFEROMETRIC LASER PROCESSING

摘要

The present disclosure relates to the field of laser induced modification and processing of materials. Modification is achieved by confining laser-material interaction within an array of narrow zones characterizing an optical interference profile. Disclosed is a method of laser induced modification of a material comprising applying at least one laser pulse to the material, the at least one laser pulse being incident on the first interface of the material, wherein the material is selected on the basis that it can support an optical interference pattern such that a thin volume at a site of at least one intensity maxima of the optical interference pattern is characterized by a laser intensity above a threshold value to responsively produce the laser induced modification of the material at a location relative to the first interface.