| 摘要 |
<p>PURPOSE: A method of manufacturing light emitting diode package and light emitting diode package fabricated therefrom are provided to improve productivity and heat radiation by forming a heat sink through injection molding. CONSTITUTION: A lead frame comprises first and second lead frames(110a, 110b). A heat sink has a cavity which is made through an injection molding using a mold and accommodates the first frame. A housing accepts the first, the second lead frame, and the heat sink. A light emitting diode chip is mounted in the first lead frame in the cavity. A molding material is filled in the cavity while being covered by the molding material.</p> |
