发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide: a method for manufacturing a semiconductor substrate which enables the improvement of a GaN layer in crystal quality; and a semiconductor device arranged by use of the semiconductor substrate.SOLUTION: A method for manufacturing a semiconductor substrate 1 comprises the steps of: growing an AlN layer 3 on a substrate 2; growing an AlGaN layer 4, of which the content of Al is 3.5-9%, on a surface 3a of the AlN layer 3 with Group III gas and Group V gas; growing a GaN layer 5 having a thickness of 250-1400 nm on a surface 4a of the AlGaN layer 4 with Group III gas and Group V gas; and growing an electron-supply layer 6 on the GaN layer 5. The supply of Group III gas is suspended for a length of time included in a range of 80-220 seconds after the growth of the AlGaN layer 4, but before the growth of the GaN layer 5.</p> |
申请公布号 |
JP2015185809(A) |
申请公布日期 |
2015.10.22 |
申请号 |
JP20140063797 |
申请日期 |
2014.03.26 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
YUI KEIICHI;NAKADA TAKESHI;MAKABE ISAO;KOUCHI TAKESHI |
分类号 |
H01L21/338;H01L21/205;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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