封装结构及其制法;PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

一种封装结构，系包括：基板，系具有相对之第一表面与第二表面；至少一电子元件，系设于该基板之第一表面上；以及封装体，系设于该基板之第一表面上并包覆该些电子元件，且该封装体之外观轮廓系呈非矩形体，以减少该封装体中之无效空间。本发明复提供该封装结构之制法。; at least one electronic component which is provided on the first surface of the substrate; and a package body which is provided on the first surface of the substrate and coats the electronic components, the exterior contours of the package body is presented non-rectangular body, to decrease the ineffective space in the package body. This invention further provides a manufacturing method of the package structure.