| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor chip which has a simple structure but allows a decrease in tension angle of a wire for electrically connecting a semiconductor chip and a wiring board; and provide a semiconductor device on which the semiconductor chip is mounted.SOLUTION: A semiconductor chip comprises at least one row of a first electrode pad group. The first electrode pad group includes at least one first independent electrode pad and a plurality of first common electrode pads. When assuming that a pitch between the first independent electrode pad and the adjacent electrode pad is "first pitch" and a pitch between the first common electrodes is "second pitch", the first pitch is set wider than the second pitch. |
