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发明名称
Wafer joinig method wafer assemblage and chip
摘要
<p>본 발명은 제 1 웨이퍼(1)를 적어도 하나의 제 2 웨이퍼(2)에 접합하는 방법에 관한 것이다. 상기 방법은 다음의 단계들을 특징으로 한다:웨이퍼들(1, 2, 14) 중 적어도 하나의 웨이퍼 상에 소결 가능한 접합 재료(7)를 제공하는 단계, 웨이퍼들(1, 2, 14)을 서로 결합하는 단계 및 가열에 의해 접합 재료(7)를 소결하는 단계. 또한 본 발명은 웨이퍼 조립체(10) 및 칩에 관한 것이다.</p>
申请公布号
KR101576443(B1)
申请公布日期
2015.12.10
申请号
KR20107002116
申请日期
2008.07.04
申请人
로베르트 보쉬 게엠베하
发明人
도니스, 디터;쾨니히, 옌스
分类号
B81C1/00;H01L21/20;H01L21/30
主分类号
B81C1/00
代理机构
代理人
主权项
地址
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